Cleave Test Reticles

Benchmark offers two types of Cleave Reticles designed to provide cleavable patterns for SEM applications. These reticles dramatically reduce the time required to characterize data from cleaved wafers.

Benchmark’s M-Cleave Reticle's pattern covers the entire field, allowing a full-field cleave through focus or exposure. This Reticle is extremely useful when an automated SEM is used and the entire field is required. Six locations of the lens allow microstepping of the entire field up to 20 times through either focus or exposure. Step horizontally or vertically to cleave the entire edge or center of the field in one easy step.

Benchmark’s Q-Cleave Reticle provides a cleavable pattern for SEM applications. The Reticle allows for large cleavable arrays, and is ideal for center-of-field or resist and process characterization.

Features

• Electrical probe structures included
• Contacts and lines available for all field sizes
• Custom designs available
• Line sizes for 193 nm requirements
• Clear field and dark field versions available
• OPC and phase-shifted versions available

Applications

• Illumination Uniformity
• Resist or Process Characterization
• Resolution
• Focus
• Exposure

For information on Benchmark’s Cleave Reticles, contact us.